Components are mounted by placing them directly onto the PCB&'s surface

SMT Assembly -- Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble




SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single or double-sided component insertions. Our production facilities can assemble the following SMT

• Ball Grid Array (BGA)




• Ultra-Fine Ball Grid Array (uBGA)




• Quad Flat Pack No-Lead (QFN)

• Quad Flat Package (QFP)

• Small Outline Integrated Circuit (SOIC)

• Plastic Leaded Chip Carrier (PLCC)

• Package-On-Package (PoP)




• Small Chip Packages (pitch of 0.2 mm)